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Tailored PCB Manufacturing Solutions PCBA Assembly for Round and Rectangular Boards

PCBA Production Capacity: Unlock a world of unmatched superiority in Printed Circuit Board Assembly (PCBA) through our d;

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Basic Info.

Model NO.	FONIETO-1
Layers	1-22 Layers
Base Material	FR-4
Certification	RoHS, CCC, ISO
Customized	Customized
Condition	New
Solder Resist Color	Green;Red;Yellow;Black;White
Order Qty	No Limited
Shape	Retangular, Round, Slots, Cutouts, Complex, Irreg
Surface Finished	HASL, Gold Finger, OSP, Enig, Peelable Mask
Transport Package	Inner Vacuum Packing Outer Carton Box
Specification	FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
Trademark	OEM, ODM
Origin	China
HS Code	8534009000
Production Capacity	100000pieces/Year

Product Description

Tailored PCB Manufacturing Solutions PCBA Assembly for Round and Rectangular Boards

PCBA Production Capacity: Unlock a world of unmatched superiority in Printed Circuit Board Assembly (PCBA) through our dynamic and cutting-edge manufacturing prowess. Our advanced production facilities are meticulously crafted to address the multifaceted demands of a wide array of industries, guaranteeing precision, reliability, and unparalleled efficiency in each bespoke circuit board solution we provide.

Delivery time	Samples	5pcs ~ 100pcs	1 Day	All the above time starts after all components and PCB materials are ready
	Small batch	101pcs ~ 5000 pcs	3 Days
	Medium batch	5001pcs ~ 10000 pcs	5 Days
	Large batch	>10001pcs	15 Days
Production capacity	SMT 2 million points/day; DIP 250,000 points/day; 5-10 models/day
Component Range	Min. 01005(0.4mm*0.2mm) Max. 55mm(H25mm)
PCB Size	Min. 50mm50mm (Suggest >100mm100mm) Max. 460mm*1200mm
Max. Thickness	The batch size is not more than 3 mm, and the model is unlimited
Placement Accuracy	+/- 40 micrometer (Chip) +/- 30 micrometer (IC)
PCB Types	PCB rigid board (FR-4, metal substrate), PCB flexible board (FPC), soft and hard PCB
File Format	Bill of Materials (BOM), PCB files (Gerber files and PCB design format files), coordinate files
Solder paste tin wire tin bar	Lead-free solder paste, customed solder paste, Brand solder paste
Steel Mesh	Laser stencil IC and BGA components can reach PC-2 Class
Component Packaging	We accept SMT components in reel, cutting tape, tube, tray, etc. which can be packed on the machine. DIP components can be packed in bulk.
Component Purchase Service	1 Foundry only (Customers provide PCB components) 2 Part of the substitute materials (customers provide core components and special components, we can purchase other components on behalf of us) 3 A full set of substitute materials (reduce purchase cost and communication cost)
Test	1IQC: ncoming inspection. 2 IPQC: In-production inspection. 3 Visual QC: regular quality inspection. 4 On-line AOI: Check the soldering effect of solder paste, SMD components, few parts or component polarity. 5 X-Ray: Check BGA, QFN and other high-precision hidden PAD components. 6 Test function and performance according to customer's test procedures and steps. 7 Aging test: According to the customer's test time for aging.

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